![]() ![]() The die is small, with heat concentrated in eight distinct regions of the chip. The additional thermal headroom can also be used to reach even faster frequencies and higher performance.Īlthough liquid metal’s properties are consistent regardless of the processor, our research indicates that Intel CPUs have the most to gain. Lower temperatures help processors sustain higher clock speeds for longer, and also prevent fans from ramping up to louder RPMs. The improved thermal interface creates margin that can be used in different ways. Our engineers observed a 10~20☌ reduction in temperatures depending on the CPU. The benefits are well-established in overclocking and DIY circles, and internal testing reinforced the appeal for gaming laptops. These alloys are highly conductive, so they’re extremely effective at transferring thermal energy between surfaces like a processor die and heatsink. Liquid metals have low melting points that render them fluid at room temperature. This is the story of how we’re bringing liquid metal to the masses. For more than a year, we’ve been developing a proprietary process and machine capable of applying it at scale. Serious overclockers and enthusiasts have long used liquid metal on high-end machines, but it’s typically applied by hand, which isn’t feasible for mass production. We’re excited to bring this exotic material to the entire 2020 lineup of ROG gaming laptops with 10th Gen Intel Core processors. This drive to innovate led to liquid metal compound that more efficiently transfers heat between the CPU and cooling module, providing headroom to improve performance, lower temperatures, and reduce noise. Cooling is one of the greatest challenges facing gaming laptops, and ROG is constantly looking for ways to improve. ![]()
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